Pain point
Loop biofilm raises thermal resistance and differential pressure, eroding available compute and driving O&M cost. Heavy chemical programs can attack cold-plate and pipe materials, while discharge compliance still needs answers.
AI data center · Liquid cooling
Biofilm in CDUs and cold plates cuts heat transfer and raises clog risk. Hyper Flux™ uses 265nm physical suppression to reduce harsh chemical load on piping and plates—with DCIM-ready operating evidence.
Loop biofilm raises thermal resistance and differential pressure, eroding available compute and driving O&M cost. Heavy chemical programs can attack cold-plate and pipe materials, while discharge compliance still needs answers.
Deploy 265nm long-term biofilm suppression on coolant / recirculation paths, hold dose with sensor feedback, and export flow, UV status, and alert trends for facility monitoring.
Share CDU count, design flow, coolant type, and hall topology. See the use-case summary or FAQ.